AG TermoPasty TermoGlue 10 g

TermoGlue – Professional Thermally Conductive Adhesive for Electronics and Heatsinks

TermoGlue is a high-grade thermally conductive adhesive designed as a reliable solution for professional electronics and industrial automation. It combines the function of a durable mechanical bond with effective heat transfer. This product was created for mounting components that require stable fixation while maintaining thermal continuity, serving as an excellent alternative to thermal pads or pastes where the use of traditional clips or screws is impossible. Its unique formula guarantees thermal conductivity of 1.0 W/mK, ensuring efficient heat dissipation from heating components to the heatsink, protecting them from overheating and failure.

The physicochemical properties of TermoGlue make it an extremely versatile material in the workshop of every service technician and engineer. The product features a very wide operating temperature range, retaining its parameters from -50°C up to 200°C, allowing its use in devices exposed to extreme thermal conditions. Once cured, the bond is mechanically strong (tensile strength 2.0 MPa ) and resistant to solvents, translating to the longevity and safety of the connection. Crucial for the safety of electronic systems, the adhesive is an excellent electrical insulator – its dielectric strength is 20.0 kV/mm, and a low dielectric constant prevents interference or short circuits.

The main area of application for TermoGlue is mounting heatsinks on memory chips, transistors, bridges, and other semiconductor components that lack factory mounting holes. Thanks to its thick consistency and excellent adhesion, the adhesive allows for the application of a layer up to 6 mm thick, enabling effective gap filling and leveling of irregularities between joined surfaces. The product is chemically safe for most materials used in electronics; it does not cause corrosion or react with the substrate. The curing process occurs spontaneously – the surface dries within 5-15 minutes , while the bond achieves full mechanical and thermal properties after 24-48 hours, depending on the layer thickness.