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ELASTOSIL® RT 602 A/B 30kg

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ELASTOSIL® RT 602 A/B – Silicone for Electronics Potting and Technical Molds

Set 30kg; mixing ratio 9:1

Two-component RTV-2 silicone with very low viscosity and excellent flow, designed for potting and encapsulating electronics in applications requiring medium hardness and high thermal resistance. It provides stable, uniform filling, fast curing at elevated temperatures, and reliable component protection thanks to excellent electrical insulation and high-temperature resistance.

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Description

ELASTOSIL® RT 602 A/B is a two-component RTV-2 silicone with very low viscosity, specifically designed for precise potting, encapsulation, and protection of electronics and technical components exposed to high temperatures. Thanks to its excellent flow properties, the mixture penetrates even the smallest gaps and cavities, creating a homogeneous, bubble-free fill even in complex geometries.

After curing, the material forms an elastomer with medium hardness (Shore A 45), very good thermal stability, and high resistance to mechanical stress. The silicone can be cured at room temperature or elevated temperatures, allowing for significant acceleration of production processes. Its chemical composition provides excellent electrical insulation, stable performance across a wide temperature range, and resistance to environmental factors.

Properties

  • Very low viscosity and excellent flow – ideal for filling intricate details

  • Medium hardness after curing (Shore A 45)

  • Can be rapidly cured at elevated temperatures

  • High mechanical strength and thermal stability

  • Excellent electrical insulation

  • Homogeneous, bubble-free structure after curing

  • Stable properties even during long-term operation

Applications

  • Potting of electronics exposed to high temperatures

  • Encapsulation of electrical and control components

  • Protection of sensors, power modules, and PCBs

  • Filling of components with complex geometries

  • Applications requiring medium hardness and dimensional stability

  • Production of devices operating under elevated temperature conditions

User Benefits

  • Precise and reliable filling of electronics due to low viscosity

  • Suitable for both small-scale and mass production processes

  • High resistance to thermal and mechanical stress

  • Reliable, long-term protection of electronic components

  • Stable and repeatable performance across production batches

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