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AG TermoPasty

Thermal Conductive Silicone Paste H 1kg

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H Thermal Conductive Silicone Paste is designed to dissipate heat from electronic and electrical components. It provides a thermal conductivity of >0.88 W/mK, excellent electrical insulation, and resistance to extreme temperatures ranging from –50°C to 250°C. Chemically inert and resistant to acids, bases, and salts, its formula is suitable for service, industrial, and electronic applications. Ideal for power modules, cooling systems, computers, HDD/DVD drives, networking devices, high-power LEDs, as well as consumer electronics and household appliances.

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Description

H Thermal Conductive Silicone Paste is a high-quality product designed for applications in devices that require efficient heat dissipation from electronic and electrical components. With a thermal conductivity of >0.88 W/mK, it ensures stable cooling of components subjected to intensive operation and high loads, protecting them from overheating and extending their service life. The advanced formula of the paste is resistant to extreme temperatures ranging from –50°C to 250°C while maintaining excellent dielectric properties, making it safe for use with electronic circuits and power components.

H silicone paste is chemically inert and resistant to acids, bases, salts, and compounds such as sulfur dioxide or ammonia, which makes it suitable for demanding working conditions — both in industrial and service environments. It can be applied to a variety of materials, including metals and plastics, providing long-term stability and reliable thermal conduction over extended periods of use.

The product has been designed for a wide range of technical applications. It is ideal for high-heat-transfer modules, cooling systems mounted on end plates and frames, HDD and DVD drives, power converters, automotive motor controllers, consumer electronics, notebooks, computers, and networking devices. It can also be used in high-power LED systems, air conditioners, and household electronics, wherever stable operation and efficient heat dissipation are required.

The paste is easy to apply — simply spread a thin, even layer on a cleaned surface, avoiding air bubbles, to achieve maximum thermal conductivity. After application, a heatsink or other cooling element can be securely mounted, ensuring durable and reliable thermal contact. This product is intended for professional use.

Thanks to its durability, stability, and versatility, H thermal conductive silicone paste provides a reliable solution for electronics service centers, manufacturing plants, maintenance departments, workshops, and installers working with modern electronic and power systems.

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